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Articles tagged "failure analysis"

  • The 16th European Microscopy Congress 2016

    Delayering of 14 nm Node Technology IC with Xe Plasma FIB

    Jozef Vincenc Oboňa (1), Tomáš Hrnčíř (1), Sharang Sharang (1), Marek Šikula (1), Andrey Denisyuk (2), Jiří Dluhoš (1)

    1. R&D, TESCAN Brno, s. r. o., BRNO, République tchèque 2. Global Applications, TESCAN ORSAY HOLDING, a.s., BRNO, République tchèque

    The burgeoning generation of electronic data and the growing need for fast processing is driving the development of unique architectures in microelectronic devices. High device…
  • The 16th European Microscopy Congress 2016

    Combining Current Imaging and Electrical Probing for fast and reliable in situ Electrical Fault Isolation

    Stephan Kleindiek (1), Andreas Rummel (1), Klaus Schock (1), Matthias Kemmler (1)

    1. Kleindiek Nanotechnik, Reutlingen, Allemagne

    Within the last decades, the feature widths of semiconductor devices have become too small to be resolved by state-of the art optical microscopes, and other…
  • The 16th European Microscopy Congress 2016

    Artefact-free top-down TEM lamella preparation from a 14 nm technology IC

    Andrey Denisyuk (1), Tomáš Hrnčíř (2), Jozef Vincenc Oboňa (2), Martin Petrenec (2), Jan Michalička (1)

    1. Applications, TESCAN ORSAY HOLDING, Brno, République tchèque 2. R&D, TESCAN Brno, Brno, République tchèque

    Semiconductor industry continues to shrink sizes of the electronic devices. Currently commercial state-of-the-art technology node for integrated circuits is 14 nm, while 10 and 7…
  • The 16th European Microscopy Congress 2016

    Precision top-down delayering of microelectronics devices using broad-beam argon ion milling

    Pawel NOWAKOWSKI (1), Kristin Olexa (1), Mary Ray (1), Paul Fischione (1)

    1. E. A. Fischione Instruments, Inc., Export, Etats-Unis

    The semiconductor industry is a dynamic, rapidly growing manufacturing sector. In 2015, global sales of semiconductor products increased 9.9% and reached a record US $335.8…

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