The 16th European Microscopy Congress 2016
Microstructure-Thermal Conductivity Relationship in Pressureles Sintered AlN Ceramics for Energy Applications
1. Materials Science and Engineering, Anadolu University, Eskisehir, Turquie
Aluminum nitride (AlN) ceramics are attractive materials for microelectronic packaging due to its high thermal conductivity, low dielectric constant and good matching of thermal expansion…
Official abstracts site for the European Microscopy Congress